Ihweku hwekuvandudzwa kwehunyanzvi hwekombiyuta, hwekutaurirana hwepamusoro, hweoptical-electronic, uye hwepasi, hwakatumira zvinodiwa zvitsva kune tekinoroji ye relay. Kuvandudzwa kwemaitiro matsva uye matekinoroji matsva pasina kupokana kunosimudzira kukura kwehunyanzvi hwe relay.

Microelectronics teknolojisinin hızlı gelişimi ve çok büyük ölçekli entegre devreler, röleler için yeni gereksinimler de ortaya koymuştur. İlk olarak, miniaturizasyon ve levha benzeri tasarım. Örneğin, askeri TO-5 (8.5×8.5×7.0mm) rölesi, entegre devre paketlemesinde, çok yüksek bir titreşim önleyici performansa sahiptir ve ekipmanın daha güvenilir olmasını sağlar; İkincisi, kombinasyon ve çok işlevsellik, entegre devrelerle uyumlu olabilmeli ve dahili amplifikatörlere sahip olmalı, hassasiyetin mikrowatt seviyesine çıkarılması gerekmektedir. Üçüncüsü ise tam katılaşmadır. Katı hal röleleri yüksek hassasiyete sahiptir ve elektromanyetik parazit ve radyo frekansı parazitini önleyebilir.

Die Popularisierung der Computertechnologie hat zu einem signifikanten Anstieg der Nachfrage nach Relais in Mikrocomputern geführt, und Relais mit Mikroprozessoren werden sich schnell entwickeln. In den frühen 1980er Jahren konnten digitale Zeitrelais, die in den Vereinigten Staaten hergestellt wurden, durch Anweisungen gesteuert werden. Die kombinierte Entwicklung von Relais und Mikroprozessoren könnte ein kompaktes und vollständiges Kontrollsystem bilden. Computersteuerbare Industrieroboter wachsen derzeit mit einer Rate von 3,5 % pro Jahr. Heutzutage ist das computersteuerbare Produktionssystem in der Lage, eine Vielzahl von kostengünstigen Relais auf einer einzigen Produktionslinie herzustellen und kann automatisch mehrere Operationen und Testaufgaben abschließen.

The development of communication technology has profound significance for the development of relays. On the one hand, the rapid development of communication technology has led to an increase in the application of the entire relay. On the other hand, as optical fibers will be the main artery for transmission in the future information society, driven by technologies such as optical fiber communication, optical sensing, optical computers, and optical information processing, new types of relays such as optical fiber relays and reed tube optical fiber switches will emerge.

Optoelectronic technology will have a huge promoting effect on relay technology. To achieve the reliable operation of optical computers, bistable relays have been trial-produced at present.

为了提高航空和航天继电器的可靠性，预计继电器的故障率应从当前的0.1PPM降低到0.01PPM。载人空间站要求达到0.001PPM。温度抗性应达到200℃以上，振动抗性要求应高于490m/s，同时应能够承受2.32×10(4)C/Kg的α射线辐射。为了满足空间要求，有必要加强可靠性研究并建立专用的高可靠性生产线。

Die Entwicklung neuer speziell strukturierter Materialien, neuer molekularer Materialien, hochleistungsfähiger Verbundmaterialien, optoelektronischer Materialien sowie sauerstoffabsorbierender magnetischer Materialien, temperaturfühlender magnetischer Materialien und amorpher weicher magnetischer Materialien ist von großer Bedeutung für die Forschung und Entwicklung neuer Relaisarten, Temperaturrelais und elektromagnetischer Relais und wird zwangsläufig zu Relais mit neuen Prinzipien und neuen Effekten führen.

随着微型化和芯片技术的进步，继电器将朝着微型化和表面贴装技术的方向发展，二维和三维尺寸仅为几毫米。如今，一些国际制造商生产的继电器体积仅为5到10年前的1/4到1/8。因为当电子整机体积减小时，需要高度不超过其他电子元件的小型继电器。通信设备制造商对紧凑型继电器的需求更加迫切。日本富士通高见泽生产的BA系列超紧凑型信号继电器仅测量14.9(W)×7.4(D)×9.7(H)mm，主要用于传真机和调制解调器，能够承受波动电压为3kV的电流。该公司推出的AS系列表面贴装继电器的体积仅为14(W)×9(D)×6.5(H)mm。

Mu munda wepamusoro relays, akachengeteka uye akavimbika relays, akadai sehigh-insulation relays, anonyanya kudiwa. Iyo JV series power relays yakatangwa neFujitsuTaKamisawa yeJapan ine amplifiers shanu uye inotora dhizaini yehigh-insulation diki cross-section. Saizi yavo i17.5(W)×10(D)×12.5(H)mm. Nekuda kwekushandiswa kwehurongwa hwakasimudzwa hweinsulation pakati pekufamba uye muganhu wekunze, kuita kwavo kweinsulation kunosvika 5kV. Kushandiswa kwemagetsi kweMR82 series power relays yakatangwa neNEC yeJapan kungori 200mW.

Installing various circuits such as amplification, delay, contact jitter elimination, arc extinguishing, remote control and combinatory logic inside the relay can endow it with more functions. With the breakthrough of SOP technology (Small Online Package), manufacturers may be able to integrate more and more functions together. The combination of relays and microprocessors will have a wider range of specialized control functions, thereby achieving high intelligence.

Ihlozi lezi zinto ezintsha eziphuma ezindaweni ezihlangene zizokhuthaza ukuthuthukiswa kokuncintisana kwezinhlobo ezahlukene ze-relay ezinezimiso, ukusebenza, izakhiwo nezicelo ezihlukene. Ngokushayelwa phambili kwezobuchwepheshe, ukufunwa, kanye nokuthuthukiswa kwezinto ezithintekayo nezisebenzayo, ukusebenza kwe-relay ezikhethekile, njengokushisa, imvamisa ye-radio, amandla aphezulu, ukuvikelwa okuphezulu, amandla aphansi e-thermoelectric, kanye ne-relay yokulawula engakwenzi, kuzothuthuka kakhulu.

Electromagnetic relays (EMR) have a history of more than 150 years since the initial use of telephone relays. With the development of the electronics industry, especially the breakthrough in optical coupling technology in the early 1970s, solid-state relays (SSR, also known as electronic relays) have emerged as a powerful force. Compared with traditional relays, it has the advantages of long service life, simple structure, light weight and reliable performance. Solid state relays have no mechanical switches and possess important characteristics such as high compatibility with microprocessors, high speed, shock resistance, vibration resistance, and low leakage. Meanwhile, since this product has no mechanical contacts and does not generate electromagnetic noise, there is no need to add components such as resistors and capacitors to maintain silence. However, traditional relays require these additional components. Therefore, traditional relays are often bulky and complex, and have a relatively high cost.

In the future, the focus of the development of the small sealed relay market will be TO-5 relays compatible with IC and 1/2 crystal cover relays. Military relays will accelerate their shift towards industry/commercialization. Military relays in the United States account for approximately 20% of the total relays. The general relay market continues to develop towards smaller, thinner and plastic-encapsulated types. Relays for small printed circuit boards will remain the mainstream products in the development of the general relay market. Solid-state relays will become more widely used, their prices will continue to decline, and they will move towards high reliability, small size, high resistance to surge current impact and anti-interference performance. The market for reed relays will continue to expand. The application fields and demand for surface-mounted relays will show an upward trend.