The rapid development of computer technology, modern communication technology, optoelectronic technology and space technology has put forward new requirements for relay technology. The development of new processes and new technologies undoubtedly promotes the development of relay technology.

The rapid development of microelectronics technology and very large-scale ics has also put forward new requirements for relays. The first is miniaturization and sheet-like design. Such as the military TO-5(8.5×8.5×7.0mm) relay in IC packaging, it has a very high anti-vibration performance and can make the equipment more reliable; The second is the combination and multi-functionality, which can be compatible with ics and have built-in amplifiers, and the sensitivity is required to be increased to the microwatt level. The third one is full solidification. Solid state relays have high sensitivity and can prevent electromagnetic interference and radio frequency interference.

The popularization of computer technology has led to a significant increase in the demand for relays used in microcomputers, and relays with microprocessors will develop rapidly. In the early 1980s, digital time relays produced in the United States could be controlled by instructions. The combined development of relays and microprocessors could form a compact and complete control system. Computer-controlled industrial robots are currently growing at a rate of 3.5% per year. Nowadays, the computer-controlled production system is capable of manufacturing a variety of low-cost relays on a single production line and can automatically complete multiple operations and testing tasks.

The development of communication technology has profound significance for the development of relays. On the one hand, the rapid development of communication technology has led to an increase in the application of the entire relay. On the other hand, as optical fibers will be the main artery for transmission in the future information society, driven by technologies such as optical fiber communication, optical sensing, optical computers, and optical information processing, new types of relays such as optical fiber relays and reed tube optical fiber switches will emerge.

Optoelectronic technology will have a huge promoting effect on relay technology. To achieve the reliable operation of optical computers, bistable relays have been trial-produced at present.

In order to improve the reliability of aviation and aerospace relays, it is expected that the failure rate of relays should be reduced from the current 0.1PPM to 0.01PPM. The manned space station requires reaching 0.001PPM. The temperature resistance should reach above 200℃, the vibration resistance requirement should be higher than 490m/s, and at the same time, it should be able to withstand α -ray radiation of 2.32×10(4)C/Kg. To meet the space requirements, it is necessary to strengthen reliability research and establish a dedicated high-reliability production line.

The development of new special-structured materials, new molecular materials, high-performance composite materials, optoelectronic materials, as well as oxygen-absorbing magnetic materials, temperature-sensing magnetic materials, and amorphous soft magnetic materials is of great significance for the research and development of new types of relays, temperature relays, and electromagnetic relays, and is bound to give rise to relays with new principles and new effects.

With the improvement of miniaturization and chip technology. Relays will develop in the direction of miniaturization and surface mount technology with two-dimensional and three-dimensional dimensions of only a few millimeters. Nowadays, the volume of relays produced by some international manufacturers is only 1/4 to 1/8 of that of 5 to 10 years ago. Because when the electronic complete machine is reduced in volume, smaller relays whose height does not exceed that of other electronic components are required. Communication equipment manufacturers have a more intense demand for compact relays. A BA series ultra-compact signal relay produced by FujitsuTakamisawa of Japan measures only 14.9(W)×7.4(D)×9.7(H)mm and is mainly used in fax machines and modems, capable of withwithers with fluctuating voltages of 3kV. The volume of the AS series surface-mounted relays launched by this company is only 14(W)×9(D)×6.5(H)mm.

In the field of power relays, safe and reliable relays, such as high-insulation relays, are particularly needed. The JV series power relays launched by FujitsuTaKamisawa of Japan contain five amplifiers and adopt a high-insulation small cross-section design. Their dimensions are 17.5(W)×10(D)×12.5(H)mm. Due to the adoption of an enhanced insulation system between the movement and the outer edge, its insulation performance reaches 5kV. The power consumption of the MR82 series power relays launched by NEC of Japan is only 200mW.

Installing various circuits such as amplification, delay, contact jitter elimination, arc extinguishing, remote control and combinatory logic inside the relay can endow it with more functions. With the breakthrough of SOP technology (Small Online Package), manufacturers may be able to integrate more and more functions together. The combination of relays and microprocessors will have a wider range of specialized control functions, thereby achieving high intelligence.

The emergence of new technologies in clusters will promote the competitive development of various types of relays with different principles, performances, structures and applications. Driven by technological progress, demand traction, and the development of sensitive and functional materials, the performance of special relays, such as temperature, radio frequency, high voltage, high insulation, low thermoelectric potential, and non-electrical control relays, will be increasingly improved.

Electromagnetic relays (EMR) have a history of more than 150 years since the initial use of telephone relays. With the development of the electronics industry, especially the breakthrough in optical coupling technology in the early 1970s, solid-state relays (SSR, also known as electronic relays) have emerged as a powerful force. Compared with traditional relays, it has the advantages of long service life, simple structure, light weight and reliable performance. Solid state relays have no mechanical switches and possess important characteristics such as high compatibility with microprocessors, high speed, shock resistance, vibration resistance, and low leakage. Meanwhile, since this product has no mechanical contacts and does not generate electromagnetic noise, there is no need to add components such as resistors and capacitors to maintain silence. However, traditional relays require these additional components. Therefore, traditional relays are often bulky and complex, and have a relatively high cost.

In the future, the focus of the development of the small sealed relay market will be TO-5 relays compatible with IC and 1/2 crystal cover relays. Military relays will accelerate their shift towards industry/commercialization. Military relays in the United States account for approximately 20% of the total relays. The general relay market continues to develop towards smaller, thinner and plastic-encapsulated types. Relays for small printed circuit boards will remain the mainstream products in the development of the general relay market. Solid-state relays will become more widely used, their prices will continue to decline, and they will move towards high reliability, small size, high resistance to surge current impact and anti-interference performance. The market for reed relays will continue to expand. The application fields and demand for surface-mounted relays will show an upward trend